| Results found for: tape automated bonding |
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| tape automated bonding |
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A process that places bare chips onto a printed circuit board (PCB) by first attaching them to a polyimide film. The film is moved to the target location, and the leads are cut and soldered to the board. Also called a "tape carrier package" (TCP), the bare chip is then encapsulated ("glob topped") with epoxy or plastic. See chip on board.
After the chip leads are cut and soldered to the board, the chip is covered with a glob of epoxy or plastic. (Illustration courtesy of Joseph Fjelstad.)
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Entries before tape automated bonding
TANSTAAFL
tantalum capacitor
TAO
tap
tape
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Entries after tape automated bonding
tape automation
tape backup
tape cartridge
tape cassette
tape drive
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