Intel To Integrate Analog, Digital Components Onto One Chip

Intel

Maloney, speaking at the Intel Developer Conference here, said the chip maker plans to announce in the next few weeks some key manufacturing processes that will particularly benefit chips developed for the Communications Group.

In particular, Maloney said the 0.09-micron technology will allow the microprocessor to add new kinds of components onto the die. The 0.09-micron technology is Intel's next-generation manufacturing process that is expected to be first available next year and will supercede this year's 0.13-micron technology.

"The [new process has some very communication-oriented techniques," he said.

For example, Intel will be able for the first time to integrate onto one chip analog components necessary for communications processing, Maloney said.

The new processes will allow Intel to build-in a variety of different wireless standards onto one chip, eliminating competing technologies, such as the current battle between WiFi (802.11b) and 802.11a, he said.

As for the overall outlook of the entire communications industry, Maloney acknowledged that the near future looks pretty bleak. "This is clearly the worst recession this industry has ever seen," he said.

But Maloney added he believes the glut in bandwidth isn't as wide as claimed by the mainstream media. Internet usage is continuing to grow at a healthy pace, so the industry could begin to see some traffic problems by the second half of 2003, he said.

The question then will be whether service providers raise prices or if they purchase and deploy new equipment, Maloney said.