IDF: 25 Products Building The Intel Ecosystem, One Hardware Or Software Piece At A Time


Invensas: Upside-down Semiconductors

Invensas, a San Jose, Calif.-based provider of semiconductor technology solutions, used IDF to demonstration several of its recent semiconductor advances.

The Invensas Multi-Die Face-Down (xFD) product in use with multiple tablet and Ultrabook solutions connects memory chips in an upside-down shingle-stack configuration and then interconnects them with ultra-short wire-bonds to reduce component size while increasing product bandwidth, speed and performance.

Invensas' Bond Via Array (BVATM) mobile solutions connect mobile system-on-chip (SoC) processors with their associated mobile memory chips to enhance bandwidth while reducing battery drain.