Intel CEO Pat Gelsinger To Discuss Comeback Plan In Live Webcast

The March 23 webcast by Pat Gelsinger, who became Intel’s CEO last month, will likely address the company’s future manufacturing strategy and how he plans to return the chipmaker to a technology leadership position after years of setbacks.


Intel CEO Pat Gelsinger is set to give an update in a live webcast next week that will likely address the company’s future manufacturing strategy and how he plans to overcome previous missteps to make Intel “the leader in every category in which we compete.”

The Santa Clara, Calif.-based company announced Wednesday that Gelsinger will give a “business update and webcast address on the new era of innovation and technology leadership at Intel” in a live webcast on the company’s website on Tuesday, March 23, at 5 p.m. ET.

[Related: 8 Bold Statements From Incoming Intel CEO Pat Gelsinger]

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Gelsinger, who became CEO of the company last month, promised in January that he would make a decision on to what extent Intel will rely on external foundries for products after he joined the company in mid-February. At the time, he said, the company would largely continue to embrace its traditional model as an integrated device manufacturer despite any plans to expand outsourcing.

Intel has suffered from manufacturing missteps in the last few years that have resulted in delays for both 10-nanometer and 7nm products, which has allowed manufacturing rivals TSMC and Samsung to arm fabless chipmakers like AMD and Nvidia with next-generation processes sooner.

During the company’s January earnings call, Gelsinger said he was “pleased” with the progress in fixing its 7nm issues, which prompted a six-month delay for 7nm products last year, and that he’s confident Intel will manufacture a majority of its 2023 products internally.

However, he said at the time, Intel will likely expand its use of external foundries “for certain technologies and products.” Prior to Gelsinger’s appointment as Intel’s CEO, a report in early January said Intel was in discussions with TSMC and Samsung to outsource production of some of its top chips.

The launch of new 7nm server processors earlier this week by the company’s largest CPU rival, AMD, underlines the challenges Intel has faced in remaining competitive amid its manufacturing issues. Multiple partners told CRN this week that AMD’s new third-generation EPYC Milan processors widens the performance gap the chipmaker has over Intel’s Xeon Scalable processors.

“Gelsinger has his work cut out for him, because he basically stepped into a fire with a garden hose, and he’s got to figure out how to fix it,” said an executive at a server system integrator, who asked to not be named to speak frankly. “He was in trouble before [AMD] announced Milan, and now with Milan officially being out and [getting] all the hardware support, I think his job just gets harder.”

On the second day of his job as Intel’s CEO, Gelsinger vowed to employees in a letter that Intel will become “the leader in every category in which we compete.”

“We must stay ahead of customer needs and become more agile in a very competitive market and prove the differentiated value of our products, our roadmap and our manufacturing capability,” he said in the Feb. 16 letter.