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10 Hot New Processors From Intel, AMD And Nvidia At CES 2019

Technology heavyweights Intel, AMD and Nvidia all introduced new processors for next-generation computing at CES 2019. Here’s a look at 10 of these new processors.

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Intel Lakefield Hybrid CPU

Lakefield is a new hybrid CPU architecture that uses Intel's new Foveros 3-D packaging technology, which stacks logic chips on top of each other for the first time. Lakefield includes a 10nm Sunny Cove core for high performance and four Atom-based cores for power efficiency. The nature of the 3-D stacking technology will give Intel's OEM partners the ability to design thinner and lighter form factors that provide long battery life, performance and connectivity. The company expects to begin producing Lakefield chips this year.

 
 
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