Homepage This page's url is: -crn- Rankings and Research Companies Channelcast Marketing Matters CRNtv Events WOTC Jobs HPE Zone Intel Partner Connect Digital Newsroom Dell Technologies World Newsroom Dell Technologies Newsroom HP Reinvent 2020 Newsroom IBM Newsroom The IoT Integrator Lenovo Newsroom NetApp Data Fabric Intel Tech Provider Zone

10 Hot New Processors From Intel, AMD And Nvidia At CES 2019

Technology heavyweights Intel, AMD and Nvidia all introduced new processors for next-generation computing at CES 2019. Here’s a look at 10 of these new processors.

Back 1 ... 4   5   6   7   8   ... 11 Next

Intel Lakefield Hybrid CPU

Lakefield is a new hybrid CPU architecture that uses Intel's new Foveros 3-D packaging technology, which stacks logic chips on top of each other for the first time. Lakefield includes a 10nm Sunny Cove core for high performance and four Atom-based cores for power efficiency. The nature of the 3-D stacking technology will give Intel's OEM partners the ability to design thinner and lighter form factors that provide long battery life, performance and connectivity. The company expects to begin producing Lakefield chips this year.

Back 1 ... 4   5   6   7   8   ... 11 Next

sponsored resources