To allow the 4GHz Core i7 processor to operate on motherboards with the existing 9 Series chipset, Intel engineers had to clear two major technological hurdles: how to deliver more power and how to remove the heat that would be generated as a result. Speaking with the CRN Test Center in a confidential briefing, Lisa Graff, Intel's vice president and general manager of desktop client platforms, said, "They added a huge number of capacitors on the underside of the die to to crank up the power and provide a smooth power delivery into the die. And the second thing was to handle the thermals." That required the development of the so-called Next-Generation Polymer Thermal Interface Material (NGPTIM), a long way of describing an all-new thermal conductive paste. "These souped-up materials work with existing cooling systems packages and sockets," she said.
Ingram Micro executive vice president and Americas group president Paul Bay says rather than focus on technology and its delivery, Ingram Micro today is all about the business outcome the channel needs to deliver.