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Intel’s Roadmap and Future Products: 5 Things Partners Should Know

Intel partners should pay attention to the company's new announcements, especially its new 3D chip packaging and API software technologies, because of the new opportunities they will create for resellers, an analyst tells CRN.

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3D Stacking Tech Changes Chipmaking Game

Perhaps one of the most consequential announcements for Intel's future was a new 3D chip packaging technology called Foveros that will change the way Intel chips are made in the future by combining high-performance, high-density and low-power silicon process technologies.

Patrick Moorhead, president and principle analyst for Moor Insights and Strategy, said Foveros is the first time he's seen the technology, which evolves chips from a monolithic integrated circuit design to a multi-layer chips that can stack logic chips (i.e. CPUs, GPUs, etc.) on top of each for the first time.

"People have put memory on top of logic, but nobody has ever put logic on top of logic," he said.

Intel said Foveros will give chip designers the ability to create new kinds of chips that "mix and match" technology IP blocks with various memory and I/O elements. Moorhead said this will open up new mass customization opportunities for Intel, which, in turn, means new opportunities for channel partners to provide customers with hardware that is more workload-specific.

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