3. AMD Unveils New 3D Chiplet Technology For Next-Gen CPUs
During AMD’s Computex 2021 keynote, CEO Lisa Su revealed the next major evolution of the company’s processors with a new 3D chiplet technology that will improve performance.
Su showed off the first application of AMD’s 3D chiplet technology with a Ryzen 5000 CPU that has a 3D vertical cache bonded to it, which she said will improve gaming performance by an average of 15 percent. This is a big deal, according to Su, because the performance improvement from the 3D vertical cache is tantamount to performance gains typically seen with a new chip architecture.
With the 3D vertical cache, AMD will be able to add 64 MB of SRAM on the top of each core complex within a CPU, which will triple the CPU’s L3 cache, according to Su. That will result in 96 MB of cache per core complex and a total of 192 MB of cache for a 12-core or 16-core Ryzen 5000 CPU.
Su said AMD plans to begin production of its highest-end Ryzen 5000 processors with the 3D vertical cache by the end of the year.
