While AMD is set to beat Intel to the market with a next-generation CPU this year, Intel is working on shaking up the way we think about CPUs with a new hybrid architecture called Lakefield. Revealed during Intel's press conference Monday, Lakefield is based on the company's new Foveros 3-D stacking technology, which evolves chips from a monolithic integrated circuit design to multi-layer chips that stack logic chips on top of each other.
Gregory Bryant, head of Intel's Client Computing Group, said Lakefield will include a 10-nanometer Sunny Cove core for high performance and four Atom-based cores for power efficiency. He said the nature of Lakefield's 3-D chip design will give OEM partners the ability to design thinner and lighter form factors that provide long battery life, performance and connectivity—including designs that are smaller than 11 inches.
Lakefield-based systems will launch later this year.