Intel Enters New Collaboration With IBM For Next-Gen Chip Technologies
To support Intel’s IDM 2.0 strategy, the company is beginning a new research collaboration with IBM to create next-generation logic and packaging technologies for processors.
Gelsinger said the new collaboration will “accelerate the velocity of packaging and process innovations into the future” — a sentiment that was shared by IBM CEO Arvind Krishna in Intel’s webcast.
“This represents an important milestone in the world of technology,” Krishna said. “By bringing together two of the best semiconductor research organizations in the world, we will greatly accelerate innovations in the semiconductor industry.”
In a press release, IBM said the collaboration “will enhance the competitiveness of the U.S. semiconductor manufacturing industry, support key U.S. government initiatives, and help deliver significant economic value.”
Krishna said IBM has a “long tradition of creating game-changing innovations in the industry” and that the new collaboration will provide a boost to 5G, hybrid cloud, AI and other technologies.
“The future of technology has to be built on a foundation of deep industry collaboration,” he said.
IBM is expected to release its 7-nanometer Power10 processor for the company’s Power systems in the second half of this year. The Power10 will be IBM’s first commercialized processor made using Samsung’s 7nm manufacturing node as part of a long-term strategic partnership.